MOLEX 95501-2881 - Modular Jack Right-Angle Through Hole 8/8 Low Profile - Tray

In stock
SKU: 95501-2881
€0.69 €0.56 Excl. Tax Incl. Tax
Technical information & projects
Tiina Weckman [email protected]
+358102891294
Weight 2.4 g
Unit of measure pcs
Product number 95501-2881
Part number 955012881
Brand Name MOLEX

Vantaa

By order

Delivery time: 175 business days

pcs

2772 pcs / package

€0.00 €0.00 Excl. Tax Incl. Tax

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Description

Molex 95501-2881 Modular Jack Right Angle Through Hole, 8/8 Low Profile

Molex Molex 95501-2881 moduar PCB jack has 8 contacts mates with 90075 Modular Plug.

Technical specifications:

  • Series: 95501
  • Reflow Capable Modular PCB Jack 8/8, RJ45
  • Performance Category: 3
  • UPC 822350967556
  • Physical
  • Resin color: Black
  • Max matiing cycles: 2500
  • Flammability rating: 94V-0
  • Jack Height: 11.50mm
  • Material - Metal: Copper Alloy
  • Material - Plating Mating: Gold over Palladium Nickel
  • Material - Plating Termination: Tin
  • Resin material: High Temperature Thermoplastic
  • Orientation: Right Angle (Side Entry)
  • PCB Locator
  • PCB Retention
  • Recommended PCB Thickness: 1.57mm
  • Packed in tray
  • Pitch - Mating Interface: 1.02mm
  • Pitch - Termination Interface: 1.27mm
  • Plating min - Mating: 0.051µm, 0.600µm
  • Plating min - Termination: 1.905µm
  • 1 Port
  • Positions / Loaded Contacts: 8/8
  • Surface Mount Compatible (SMC) 
  • Operating Temperature Range: -40°C ... +85°C
  • Termination Interface: Through Hole
  • Current - Maximum per Contact: 1.5A
  • Voltage - Maximum: 125V DC

Check more technical information from the datasheet.

Description

Molex 95501-2881 Modular Jack Right Angle Through Hole, 8/8 Low Profile

Molex Molex 95501-2881 moduar PCB jack has 8 contacts mates with 90075 Modular Plug.

Technical specifications:

  • Series: 95501
  • Reflow Capable Modular PCB Jack 8/8, RJ45
  • Performance Category: 3
  • UPC 822350967556
  • Physical
  • Resin color: Black
  • Max matiing cycles: 2500
  • Flammability rating: 94V-0
  • Jack Height: 11.50mm
  • Material - Metal: Copper Alloy
  • Material - Plating Mating: Gold over Palladium Nickel
  • Material - Plating Termination: Tin
  • Resin material: High Temperature Thermoplastic
  • Orientation: Right Angle (Side Entry)
  • PCB Locator
  • PCB Retention
  • Recommended PCB Thickness: 1.57mm
  • Packed in tray
  • Pitch - Mating Interface: 1.02mm
  • Pitch - Termination Interface: 1.27mm
  • Plating min - Mating: 0.051µm, 0.600µm
  • Plating min - Termination: 1.905µm
  • 1 Port
  • Positions / Loaded Contacts: 8/8
  • Surface Mount Compatible (SMC) 
  • Operating Temperature Range: -40°C ... +85°C
  • Termination Interface: Through Hole
  • Current - Maximum per Contact: 1.5A
  • Voltage - Maximum: 125V DC

Check more technical information from the datasheet.

Technical information & projects
Tiina Weckman [email protected]
+358102891294

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